Connected vehicles: NXP signs an agreement with Foxconn

Kurt Sievers, President and CEO of NXP Semiconductors: "We are proud to join forces with Foxconn to support its ambitious leap into the automotive industry and together address the challenges and opportunities of a new generation of smart connected vehicles."

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NXP Collaborates with Foxconn on Next Generation Vehicle Platforms

NXP has signed a memorandum of understanding with Hon Hai Technology Group ("Foxconn") to jointly develop platforms for a new generation of smart connected vehicles. Kurt Sievers, President and Ceo of NXP Semiconductors, commented, "We are proud to join forces with Foxconn to support its ambitious leap into the automotive industry and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, particularly Foxconn's new electric vehicle platform. The automotive industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next-generation architectures, smart and secure car access systems, and more."

Foxconn will leverage NXP's portfolio of automotive technologies and long-standing safety expertise to enable architectural innovation and platforms for electrification, connectivity, and safe automated driving. The collaboration initially covers the digital cockpit based on the NXP i.MX application processors and Software Defined Radio platform, but the goal is to expand it to S32 processors, analog front-end, drivers, networking, and power products. NXP will offer hardware and software support and leverage the expertise of its all-around third-party ecosystem in the areas of electrification, connectivity, and automation.

"NXP's long-standing experience and leadership in the automotive industry, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today," said Young Liu, president of Foxconn.


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