Molex has acquired the core technology and intellectual property (IP) from Keyssa Inc.a pioneer in the field of high-speed contactless connectors. The acquisition of this wireless technology, which includes more than 350 patent applications filed, will accelerate Molex's strategy to further expand and diversify its micro connector portfolio with highly flexible, cable-free connectors for near-field and device-to-device applications.
"Keyssa's wireless chip-to-chip technology complements Molex developments related to mmWave antenna connectivity to meet growing demands for high data stream transmissions," said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. "We are continually fostering technology development for mobile and consumer device customers by providing greater freedom in product design and supporting next-generation wireless connectivity needs."
Optimisation of device-to-device communications
The acquired technology operates at data transfer rates of up to 6 Gbps over a 60 GHz band without WiFi or Bluetooth interference. The small, low-power, low-latency, solid-state contactless connectors can solve critical data transmission needs with minimal overhead. Molex intends to advance these current resources by supporting exponentially higher data rates and full-duplex communications. In addition, Molex will leverage its long-standing signal integrity expertise and mmWave antenna resources to accelerate the commercialization of new contactless connectors, complementing its existing product portfolio.
Other benefits will come from the Virtual Pipe I/O (VPIO) technology that Keyssa has developed to address protocol inefficiencies. By aggregating high and low-speed protocols for simultaneous transmission over one or more links, VPIO helps compensate for real-time events that affect link performance integrity. Used in combination, VPIO and contactless connectors can create expandable, efficient I/O without the limitations of mechanical connectors while being able to adapt and scale as required by the needs of the application.
Strategic investments
Molex is building a team of more than 25 engineers in the U.S. and India to develop next-generation products based on this technology. Initially, the focus will be on the unique connectivity needs of high-volume mobile applications where contactless connectors will offer potential design benefits in manufacturing, functionality, reliability, signal aggregation and security. Over time, Molex will apply this technology to address emerging application areas including smart factories, advanced automotive safety, medical robotics and more. "Molex has a long-standing commitment to investing in world-class solutions that not only solve the current problems of leading mobile and consumer device manufacturers, but also anticipate future challenges," said Eric VanAlstyne, director, business development, Molex. "The decision to acquire Keyssa's technology and IP strengthens our position as a preferred supplier with innovations in mechanical and contactless connectivity."
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