Texas Instruments: new production facilities for 300 mm semiconductor wafers

The Texas Instruments investment will further increase the company's cost advantages and provide greater control over the supply chain.

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Texas Instruments
Design concept for Texas Instruments' new 300mm semiconductor wafer fab in Sherman, Texas. Construction of the first and second fabs will start in 2022, with the potential to build up to four fabs over time.

Texas Instruments has announced plans to begin construction of its new 300 millimetre semiconductor wafer fabrication facility (fab) in Sherman, Texas next year. The site in North Texas has the potential to accommodate up to four fabs to meet expected future growth in demand, particularly in the industrial and automotive markets. Construction of the first and second fabs is expected to start in 2022.

"TI's future 300mm fabs for analog and integrated processing at the Sherman facility are part of our long-term capacity planning to continue to strengthen our technological and manufacturing competitive advantage and support our customers' demand for decades to come," said Rich Templeton, TI's general manager, president and CEO. "Our commitment to North Texas has spanned more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community."

The first new factory is expected to start production as early as 2025. With the possibility of up to four fabs, the total investment potential of the site could reach around $30 billion and create 3,000 direct jobs over time.

The new fabs will complement TI's existing 300mm fabs, which include DMOS6 (Dallas, Texas), RFAB1 and RFAB2 (both in Richardson, Texas); the latter will be completed shortly and is expected to start production in the second half of 2022. In addition, LFAB (Lehi, Utah), recently acquired by TI, is expected to start production in early 2023.


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