3D semiconductor and MEMS sensor technologies and image sensors will take centre stage from 1 to 3 September 2021 at the Connecting Heterogeneous Systems Summit (CHSS) by Seeds. The event is an opportunity for industry experts from across the value chain to come together to highlight the latest advances in heterogeneous integration and sensing technology driving innovation in high-end applications. The digital event will run concurrently with the SEMI 3D & Systems and MEMS & Imaging Sensors summits.
"Advances in heterogeneous integration and sensors are crucial to driving digital transformation," says Laith Altimime, president of SEMI Europe. "SEMI's Connecting Heterogenous Systems Summit will bring together leaders from the semiconductor industry to share news and opportunities from the next generation of innovations and the digital technologies that are set to redefine the way we work and live."
