The Tektronix Innovation Forum, an annual event organised by the international benchmark test and measurement brand for engineers, kicked off on 16 June in China and will end on 16 July. The Forum consists of several sessions in China, America, Taiwan, India, Japan and Korea and is mostly held digitally. "This year marks an important time to examine global trends impacting engineering and innovation across our industry," says Chris Witt, vice president and general manager for Tektronix portfolio solutions. "This year's theme, Engineering the Future, is the perfect lens to discuss the most important issues in our field today and directly influence the innovative solutions Tektronix is known to support around the world."
Several topics are on the agenda: wide bandgap applications and validation test challenges; introduction to BioFETs; diagnosing jitter caused by power supply integrity issues in a PDN; mmWave 5G architecture and Phase Array Beamforming technology; oscilloscopes; digitisers and acquisition software for high-energy physics; new characterisation techniques for DDR5 memory generation.
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