Siemens Digital Industry acquires UltraSoc Technologies

Siemens acquires UltraSoC technology and integrates it into the Xcelerator portfolio as part of Mentor's Tessent product suite

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Siemens_UltraSoC

Siemens has signed an agreement to acquire UltraSoc Technologiesa Cambridge-based company that provides instrumentation and analytics solutions for intelligent monitoring, cybersecurity and functional safety in core system-on-chip (SoC) hardware. Siemens will integrate UltraSoC technology into the Xcelerator portfolio as part of its Tessent product suite. Mentor. The addition of UltraSoC enables the creation of a single data-driven infrastructure that enhances product quality, safety and cybersecurity and the creation of a complete solution to help semiconductor customers overcome issues such as manufacturing defects, hardware and software bugs, early failure and wear in devices, functional safety and malicious attacks.

"The acquisition will give our customers access to not only a design-for-test platform but a 'Design for Lifecycle Management' solution for system-on-chips, including functional safety, security and optimisation," commented Brady Benware, Vice President and General Manager ,Tessent, Siemens Digital Industries Software. "With an enhanced design to identify, mitigate and eliminate risks throughout the SoC lifecycle, customers can radically improve time-to-revenue, quality, product safety and profitability. UltraSoC also has a fast-growing business and a long list of customers and, as part of Siemens, will complement Tessent to create a unique offering in the market."

The special features of UltraSoC

UltraSoC is a pioneer in embedding hardware monitoring into complex SoCs, including fab-to-field analytics to accelerate the silicon bring-up process, optimise product performance and confirm that devices are operating according to design requirements in terms of functional safety and cybersecurity. Tessent creates design-for-test (DFT) solutions for SoCs and has established itself in the field of automotive functional safety with its Tessent Safety Ecosystem. The complementarity of the two offerings will benefit the entire semiconductor lifecycle.

According to Rupert Baines, CEO of UltraSoC: 'This acquisition broadens our vision: being part of a company like Siemens will allow us to accelerate our R&D activities, leverage more resources for go-to-market and a large global structure'.

UltraSoC's products are widely used in the automotive, high performance computing, storage and semiconductor industries. The company has recently been selected to participate in the DARPA AISS (Automatic Implementation of Secure Silicon) and is a member of the Secure-CAV consortiumwhich aims to improve the safety and security of self-driving vehicles.

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